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Thermoformed Trays

Thermoforming trays are plastic vacuum-formed products designed to protect and transport semiconductor and precision electronic components.

They protect the products inside the tray from physical impact, electromagnetic interference, and foreign material during transportation.

Made with advanced plastic material technology, these trays offer optimal electrical protection using a wide range of materials covering both conductive and dissipative properties.

Features

Design Custom high-precision dimensions available according to customer requirements
Materials Available in various colors and with electrically functional composite resin materials
PS, PP, transparent high-impact APET and GPET, etc.
Applicable Products
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Memory semiconductors – DRAM, SSD, LPCAMM, Flash Memory Card, etc
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Non-memory modules – LED/LCD lighting modules, automotive application modules, camera modules, etc
Technical Info
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Manufactured using air pressure thermoforming technology, providing high quality and precision trays
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Sheet thickness: 0.3 - 4.0 mm. Maximum tray size: 960 x 1,000 mm
Surface resistance Conductive, Dissipative, Insulative. (E3~E12 ohm)

본문

Thermoforming trays are plastic vacuum-formed products designed to protect and transport semiconductor and precision electronic components.

They protect the products inside the tray from physical impact, electromagnetic interference, and foreign material during transportation.

Made with advanced plastic material technology, these trays offer optimal electrical protection using a wide range of materials covering both conductive and dissipative properties.